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Corrosion protection properties afforded by an in situ electropolymerized polypyrrole layer on CuZn

机译:CuZn上的原位电聚合聚吡咯层提供的防腐性能

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摘要

Adherent polypyrrole films were electropolymerized from a near-neutral sodium oxalate solution at a CuZn electrode. The growth of these films was facilitated by the initial oxidation of the CuZn electrode in the oxalate solution to generate a zinc-containing copper(II) oxalate pseudopassive layer. This layer was sufficiently protective to inhibit further dissolution of the CuZn electrode and sufficiently conductive to enable the electropolymerization of pyrrole at the interface, and the generation of an adherent polypyrrole film. These films exhibited significant corrosion protection properties in acidified and neutral 0.1 mol dm−3 NaCl solutions. On continued immersion in these solutions, the polymer films lost some of their corrosion-protection properties, but still remained stable, offering good corrosion protection to the CuZn substrate.
机译:在CuZn电极上从接近中性的草酸钠溶液中电聚合粘附的聚吡咯膜。草酸溶液中CuZn电极的初始氧化促进了这些膜的生长,从而生成了含锌的草酸铜(II)假钝化层。该层具有足够的保护性以抑制CuZn电极的进一步溶解,并且具有足够的导电性以使吡咯在界面处电聚合,并产生粘附的聚吡咯膜。这些膜在酸化和中性的0.1 mol dm-3 NaCl溶液中表现出显着的腐蚀防护性能。在继续浸入这些溶液中时,聚合物膜失去了部分腐蚀防护性能,但仍保持稳定,从而为CuZn基材提供了良好的腐蚀防护。

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